Browse 5 exciting jobs hiring in Chiplet now. Check out companies hiring such as NVIDIA, K2 Space, Intel in North Las Vegas, Little Rock, Santa Rosa.
Lead architecture and RTL design efforts for NVIDIA's NVLINK-C2C coherent high-speed interconnects, collaborating across hardware, software and external partners to deliver chiplet-scale connectivity for GPUs, DPUs, and CPUs.
K2 Space is hiring a Principal ASIC Package Design Engineer to lead FC-BGA and MCM package architecture, vendor qualification, and production ramp for high-power satellite ASICs.
Lead and grow a chiplet verification team at Intel, driving verification strategy and execution for complex ASIC/SoC products using advanced verification methodologies.
Lead the microarchitecture, RTL design, and front-to-back implementation of complex SoC subsystems at a VC-backed semiconductor startup advancing next-generation chiplet solutions.
Lead and grow the Package Design team to deliver HVM-ready IC packaging solutions (FCBGA/FCCSP, multi-die, chiplets) that enable Astera Labs' PCIe, CXL, and Ethernet connectivity products.
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