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Senior ASIC Package Design Engineer

K2 Space is a fast-growing Series C space startup building the largest, highest-power satellites to enable new mission capabilities across orbits. We are seeking a Senior ASIC Package Design Engineer to lead FC-BGA and multi-chip module (MCM) package architecture, drive package-level SI/PI and thermal strategy, and partner with silicon, RF, and systems teams to ensure first-pass success and production ramp for power-dense, high-performance ASICs.

Skills

  • Deep expertise in FC-BGA package design and high-pin-count packages
  • Experience with MCM and heterogeneous integrations (preferred)
  • Strong SI/PI fundamentals and experience with PDN and decoupling strategies
  • Thermal management for power-dense ASICs and package-level thermal solutions
  • Proficiency with EM/SI/PI tools (SIWave, HFSS, ADS) and simulation-driven design
  • Experience working directly with OSATs, substrate vendors, and qualification processes
  • Knowledge of substrate materials, stack-ups, impedance control, and escape routing
  • Experience supporting high-speed SerDes and mixed-signal/RF interfaces

Responsibilities

  • Define ASIC package architecture for FC-BGA and MCM solutions including substrate stack-up, ball-map, power delivery, signal breakout, and mechanical constraints.
  • Lead package-level trade studies across cost, performance, SI/PI, thermal, manufacturability, and reliability.
  • Establish package design standards, methodologies, and best practices for high-performance ASICs.
  • Design detailed FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content.
  • Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning.
  • Co-optimize die floorplans and package interfaces with silicon, RF, and systems teams.
  • Support package-level SI/PI strategy including PDN design and decoupling strategy.
  • Lead package thermal architecture: lid selection, TIMs, heat spreaders, and mechanical interfaces to system cooling.
  • Drive material selection, substrate technology choices, assembly process optimization, and vendor engagement.
  • Support qualification, test methodology, and production ramp with OSATs and substrate vendors.

Education

  • Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or related field (required)
  • Advanced degree in a relevant field (preferred)

Benefits

  • Base salary range $180,000 – $260,000 + equity
  • Comprehensive medical, dental, and vision coverage
  • Paid time off and paid parental leave
  • Life insurance and other standard benefits
  • Opportunities to work on high-impact, cutting-edge space hardware
To read the complete job description, please click on the ‘Apply’ button
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DEPARTMENTS
SENIORITY LEVEL REQUIREMENT
TEAM SIZE
No info
SALARY RANGE
$180,000/yr - $260,000/yr
EMPLOYMENT TYPE
Full-time, remote
DATE POSTED
April 13, 2026
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