Semiconductor Packaging Jobs
Browse 12 exciting jobs hiring in Semiconductor Packaging now. Check out companies hiring such as Intel, Vinci4d, Eurofins in Kansas City, New York, Memphis.
Intel is hiring a Packaging Module Development Engineer to develop and qualify thermal material and mechanical design solutions for high-volume semiconductor packaging.
Process TD Engineer (Shift 7, IOS) providing on-shift process support and integration to enable 24x7 lot movement and qualification of advanced packaging technologies at Intel Foundry in Phoenix, AZ.
Intel Foundry Services is hiring a Packaging and Test Account Technical Solutions Engineer to lead customer-facing engagements and ensure successful qualification, ramp and delivery of advanced packaging solutions.
Intel's Advanced Packaging group is hiring a Yield Engineer On Shift to troubleshoot equipment and process issues, drive yield recovery actions, and support continuous lot flow in a 24x7 manufacturing environment.
Lead equipment and process optimization for Intel's 300mm bumping and metalization module to deliver high-confidence, high-volume semiconductor packaging solutions.
Vinci is hiring a Strategic Account Executive to own and expand relationships at top semiconductor firms, translating the value of its Physics AI platform into multi-million dollar deployments.
Intel is hiring an Advanced Packaging Module Development Engineer to drive process and equipment development at the module level, improving yield, reliability, and manufacturability for advanced packaging technologies.
Intel's APTM team is seeking a Packaging Module Equipment Development Engineer to drive equipment, materials and process development for advanced semiconductor packaging and scale solutions for high-volume foundry production.
Intel is seeking a Module Development Defect Inspection Engineer to lead defect inspection technology development and manufacturing process optimization for advanced packaging and high-volume production.
Lead cross-site manufacturing quality for advanced packaging and assembly at Intel Foundry, driving supplier programs, 8D-based corrective actions, and world-class quality KPIs across multiple sites.
EAG Laboratories is hiring a DPA Engineer to lead destructive physical analysis and reliability investigations on electronic components using SEM/EDS, X-ray, C-SAM and advanced cross-sectioning techniques.
Lead the silicon assembly engineering team for Starlink at SpaceX, driving scalable processes, yield improvement, and in-house IC packaging capability.
