Browse 2 exciting jobs hiring in Wafer Level Packaging now. Check out companies hiring such as Renesas Electronics, Intel in Lexington-Fayette, Oklahoma City, Kansas City.
Lead package design and qualification for advanced power SiP, flip-chip LGA, and multi-chip modules at Renesas, driving process development, supplier qualification, and production ramp for automotive, industrial, and consumer power applications.
Lead cross-site manufacturing quality for advanced packaging and assembly at Intel Foundry, driving supplier programs, 8D-based corrective actions, and world-class quality KPIs across multiple sites.
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