Power Packaging Jobs

Senior technical leader to architect next-generation DRAM systems—driving cross-stack co-optimization, RAS/telemetry features, and customer-facing strategy at Micron's Boise main site.

Lead package design and qualification for advanced power SiP, flip-chip LGA, and multi-chip modules at Renesas, driving process development, supplier qualification, and production ramp for automotive, industrial, and consumer power applications.