Browse 2 exciting jobs hiring in Packaging Architecture now. Check out companies hiring such as Micron, Intel in Colorado Springs, Cape Coral, Atlanta.
Senior technical leader to architect next-generation DRAM systems—driving cross-stack co-optimization, RAS/telemetry features, and customer-facing strategy at Micron's Boise main site.
At Intel Foundry, this Customer Enabling Engineer will lead technical customer engagements for advanced packaging—translating requirements into package architecture, coordinating NPI and schedule, and ensuring successful execution across stakeholders.
Below 50k*
0
|
50k-100k*
0
|
Over 100k*
1
|