Browse 4 exciting jobs hiring in Package Design now. Check out companies hiring such as Intel, Renesas Electronics, K2 Space in Greensboro, San Diego, Sacramento.
Intel seeks a Senior CPU Power Delivery Engineer to drive PDN design, IR/EM signoff, and cross-functional integration for next-generation CPU cores on a hybrid schedule in Austin.
Lead package design and qualification for advanced power SiP, flip-chip LGA, and multi-chip modules at Renesas, driving process development, supplier qualification, and production ramp for automotive, industrial, and consumer power applications.
Lead end-to-end physical design for cutting-edge SoCs at a high-growth Series C space company building the most powerful satellites in orbit.
Lead and grow the Package Design team to deliver HVM-ready IC packaging solutions (FCBGA/FCCSP, multi-die, chiplets) that enable Astera Labs' PCIe, CXL, and Ethernet connectivity products.
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